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6'' sapphire wafer
6'' sapphire wafer
6'' sapphire wafer
 Standard Specifications of Sapphire Substrate
 Item  Specification
 6"
 Material  High Purity,Monocrystaline,AL2O3
 Diameter  150±0.25mm
 Thickness  1300±20μm
 Orientation  C to M 0.2°±0.1°
 Flat length  47.5±1 mm
 Flat Location  A-axis[11-20]±0.3°
 Roughness of front side surface  Ra<2Å(0.2 nm)
 Edge Chamfering  T-type
 Roughness of back side surface  Ra<2Å(0.2 nm)
 TTV  ≤20μm
 BOW  ﹣5μm≤Bow≤10 μm
 Warp  <30 μm
 Package  Clean Room, vacuum package
 
 Manufacture Specifications
 Manufacture Specifications
 Dia.:2mm to 300mm+/-0.05
 Orientation: C plane, R plane, A plane, M plane
 Polish: single polish, double polish, no polish
 Shape: Circle, Square, Rectangular, With hole, according to customer’s drawing. 
 
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